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FASTPCBA Co.,Ltd
- Building 1, Senyang Electronic Technology Park, Guangming High-tech Park, Yutang Street, Guangming District, Shenzhen City.
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Generally speaking, if your circuit needs to pass a large current, it is recommended to choose a thick copper circuit board. So what exactly is a thick copper circuit board? Why choose thick copper PCB for high current?
1. What is a thick copper PCB board?
Everyone should know that the circuit board is made of copper clad laminate. There is a layer of copper foil on both sides of the copper clad laminate. When the thickness of the copper foil is ≥2oz, then the circuit board is defined as a thick copper plate.
2. What are the characteristics of thick copper PCB boards?
Copper has the function of conducting electricity on the circuit board, and the thick copper circuit board has the characteristics of carrying large current, reducing thermal strain, and good heat dissipation.
2.1 Thick copper circuit boards can carry large currents
In the case of a certain line width, increasing the copper thickness is equivalent to increasing the cross-sectional area of the circuit, which can carry a larger current.
2.2 Thick copper circuit boards reduce thermal strain
Copper foil has a small conductivity coefficient, and the temperature rise is small under the condition of large current, so it can reduce the amount of heat and thus reduce the thermal strain.
2.3 Thick copper circuit board has good heat dissipation
Copper foil has high thermal conductivity (thermal conductivity 401W/mK), which can play an important role in improving heat dissipation performance.
Based on the characteristics of the above thick copper PCB circuit board, it is recommended that you choose thick copper pcb for high current, which can better realize the circuit function.
FASTPCBA is a professional thick copper circuit board supplier, with rich manufacturing experience in the thick copper PCB field, and supports thick copper PCB proofing and mass production. Products can be widely used in high-tech fields such as microwave, aerospace, satellite communications, network base stations, hybrid integrated circuits, power high-power circuits, etc.