FPCB manufacturing materials and procedures to improve terminal flexibility
date：2018-11-06 17:55:00
FPCB manufacturing materials and procedures to improve terminal flexibility
FPCB is used in a wide range of applications, but it is basically no more than a line, printed circuit, connector and multi-function integrated system. According to the function, it can be divided into space design, change its shape, fold and flex design, and FPCB design can be used to prevent static interference of electronic equipment. The use of flexible circuit boards, if not cost, let the product quality directly on the soft board architecture, not only the design volume is relatively reduced, the overall product volume can be greatly reduced due to sheet characteristics.
The substrate structure of the FPCB is quite simple, mainly consisting of the upper protective layer and the middle wire layer. When mass production is performed, the soft point board can be matched with the positioning hole for the production process alignment and post processing. As for the use of FPCB, the shape of the sheet can be changed according to the space needs, or it can be used in a folded form, and the multilayer structure can be designed to resist EMI and static resistance in the outer layer, and the flexible circuit board can also achieve efficient EMI problem improvement design. .
On the critical circuit board, the uppermost structure of the FPCB is copper, which is divided into RA (Rolled Annealed Copper), ED (Electro Deposited), etc. The manufacturing cost of ED copper is quite low, but The material will be more susceptible to breakage or faults. RA (Rolled Annealed Copper) has a higher production cost, but its softness is better. Therefore, most of the flexible circuit boards used in the high deflection state are mostly RA materials.
As for the FPCB to be formed, it is necessary to bond different layers of the cover layer, the rolled copper, and the substrate through an adhesive. The commonly used adhesive (Achesive) has Acrylic and Mo Epoxy. Two major types are mainly used. The heat resistance of epoxy resin is lower than that of acrylic. It is mainly used for household goods, while acrylic has the advantages of high heat resistance and high strength, but its electrical insulation. Poor, and in the FPCB fabrication structure, the thickness of the adhesive is 20-40 μm (micrometers) of the overall thickness.
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