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PCB copying process

date:2018-12-04 08:43:00

PCB copying process


In the PCB copying process, due to the need to split the circuit board, the integrated circuit and other components are removed to make a BOM list, and the split PCB bare board is scanned and copied, so correctly disassembly of integrated circuits on PCB boards is also an important issue in the process .


Not only in the PCB copying process, but also in the circuit maintenance, it is often necessary to remove the integrated circuit from the printed circuit board, and because the integrated circuit pins are denser and denser, it is difficult to disassemble, sometimes damaging the integrated circuit and the circuit board. So we provide several effective methods for accurately disassembling integrated circuits, and I hope to help you.

Dispensing method of suction tin: disassembling the integrated block by using the suction device. This is a commonly used professional method. The tool is a common suction and electric soldering iron with a power of more than 35W. When disassembling the integrated block, just put the heated dual-purpose soldering iron tip on the pin of the integrated block to be disassembled, and after the solder is melted, the tin is sucked into the fine tin, and the solder of all the pins is sucked and the integrated block can be taken off.

Medical hollow needle disassembly method: take a few medical needles 8 to 12 hollow needle. It is advisable to use the inner tip of the needle just to fit the manifold block pin. When disassembling, use a soldering iron to melt the soldering of the pins. Use a needle to cover the pins in time, then remove the soldering iron and rotate the needle. After the solder solidifies, pull out the needle. This pin is completely separated from the printed board. Once all the pins have been done in this way, the integrated block can be easily removed.

Electric iron brush with disassembly method which is simple and easy, as long as there is a soldering iron and a small brush. When disassembling the integrated block, firstly heat the soldering iron. After the soldering temperature is reached and the solder on the pin is melted, the machine uses a brush to sweep away the molten solder. This allows the pins of the manifold to be separated from the printed board. The method can be performed separately or in separate steps. Finally, use a sharp tweezers or a small "one" screwdriver to pry the integrated block.

Adding solder melting disassembly method which is a reliable method. Just add some solder to the pins of the integrated block to be disassembled, so that the solder joints of each column of pins are connected, so as to facilitate heat transfer and easy disassembly. When disassembling, use a soldering iron to heat a column of pins with a sharp tweezers or a small “one” screwdriver. The two columns of pins are rotated and heated until they are removed. In general, each column of pins can be removed by heating twice.

Multi-strand copper wire disassembling method: It is to use a multi-strand copper core plastic wire to remove the plastic outer skin and use a multi-strand copper wire (a short wire head can be used). Before use, apply multiple strands of copper wire to the rosin alcohol solution. After the soldering iron is heated, place the strands of copper wire on the pins of the manifold to heat the pins. The solder on the pins will be absorbed by the copper wires. The upper solder can be cut off and the solder on the pins can be removed by repeating it several times. Braided wires in the shielded wire can also be used if available. Simply sucking the solder and using a tweezers or a small “one” screwdriver to gently remove it that the integrated block can be removed.
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