Home
FASTPCBA
PCB Board
PCB Assembly
News
QuoteSearch Products
Search News
- [Company News]PQFN printing, mounting and rework process2019/12/11/ 11:58
- The assembly process of PQFN (Plastic Quad Flat No-lead) is similar to BGA. CSP, because there is a large thermal pad on the bottom of the device, and the bottom electrode does not have the buffer function of the solder ball, so the coplanarity requirements are stricter. So it’s more difficult to assemble it than CSP
- Read（0）
Relevant Search
Spotlight
What is difference between PCB and PCBA?
- we know that PCBA gene...
- 1What is circuit board design for manufacturability?
- 253rd Earth Day on April 22, 2022
- 3What are the classifications of dry film photoresists in pcba circuit boards?
- 4What is Halogen Free PCB Board?
- 5How to solve the problem of chip components standing up during SMT assembly?
- 6What are the standards for SMT and DIP assembly of components?
- 7Advantages and disadvantages of PCB flying probe testing
- 82022 Tomb Sweeping Day Holiday
- 9What is MCPCB?
- 10How to distinguish the number of pcb layers?
Building 1, Senyang Electronic Technology Park, Guangming High-tech Park, Yutang Street, Guangming District, Shenzhen City.
F:86-13418481618
