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- [Company News]Mounting machine failure analysis and troubleshooting2019/12/13/ 14:15
- Whether the placement machine operate normal or not directly affects the placement quality and PCB manufacturing output. In order to run normally of machine, it is necessary to fully understand the structure and characteristics of the machine, to grasp the manifestations of the machine prone to various failures, the causes of failures, and the troubleshooting methods. Only by timely discovering the problem, finding out the cause, correcting and solving the problem in a timely manner, can the machine exert its proper placement efficiency.
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- [Company News]Prototype pcb panel design requirements2019/12/03/ 15:49
- In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with the same or different graphics can be used to form the panel. When the size of the prototype PCB is smaller than the minimum mounting size (<50mmx50mm), the panel method must be used, and the special-shaped board also needs to be jointed.
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- [Company News]Surface assembly process design principles2019/11/16/ 11:27
- Typical surface assembly methods include full surface assembly, single-sided mixing, and double-sided mixing. Full surface assembly means that both sides of the PCB are mounted components (SMC/SMD); single-sided mixing means that both the SMC/SMD and the through-hole components(THC) are on the PCB, and the THC is in the main Face, SMC/SMD may be on the main side or on the auxiliary side; double-sided mixing means that both sides have SMC/SMD, THC is on the main side, and there may be THC on both sides.
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- [Company News]PCB manufacturing reflow soldering process requirements2019/11/11/ 15:08
- Reflow soldering is a key process for PCB manufacturing SMT and must be carried out under controlled conditions. The process requirements for reflow soldering are as follows.
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- [Company News]Pcb manufacturing affecting solder paste printing factors2019/11/08/ 11:35
- The factors that pcb manufacturing affects solder paste printing include three aspects, namely solder paste performance, stencil and printing process.
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- [Company News]Printed circuit board reliability affecting factor2019/11/07/ 15:34
- Printed circuit board reliability depends on three aspects: 1. Design - poor design buried inherent reliability issues; 2. Manufacturing - solder joint integrity and microstructure (influencing factors during manufacturing); 3. Use - application environmental stress (deterioration factor in use)
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- [Company News]Prototype pcb manufacturing good joints mechanical properties2019/11/06/ 15:55
- The four most important characteristics of the prototype pcb manufacturing joint are: shear strength, creep, isothermal fatigue and thermomechanical fatigue. By combining the meanings of these four characteristics, a complete performance information of the solder joint can be obtained.
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- [Company News]Prototype pcb manufacturing, how to control PCB and components before wave soldering?2019/11/02/ 11:30
- For printed circuit boards that have been placed for a long time, the surface is generally cleaned, which improves the solderability of prototype pcb manufacturing, reduces virtual soldering and bridging. For component leads that have a certain degree of oxidation on the surface, the surface oxide should be removed firstly.
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- [Company News]Online pcb manufacturing welding requirements for production process materials2019/11/01/ 16:26
- Online pcb manufacturing welding requirements for production process materials
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- [Company News]PCB manufacturing companies clean - free flux requirements2019/10/30/ 17:40
- In order to make the soldered PCB meet the specified quality requirements without cleaning, the selection of flux is the key. PCB manufacturing companies usually have the following requirements for the solders without cleaning
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- [Company News]Printed circuit board manufacturers reflow soldering poor wetting solution2019/10/28/ 10:33
- The welding quality of components' solder joints is a key factor that directly affects the quality of printed circuit components and even the whole machine
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- [Company News]Prototype pcb manufacturing BGA package category and process characteristics2019/10/25/ 16:06
- The BGA package is available in PBGA, TBGA, CBGA, FBGA and other categories. PBGA and CBGA will undergo "dynamic deformation" during welding due to the different layered structure of the package and the coefficient of thermal expansion (CTE) of each layer of material. That is, Deformation will occur with increasing temperature during the re-flow soldering of prototype pcb manufacturing due to warping.
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- [Company News]Pcb manufacturing company wave soldering joint requirements2019/10/25/ 15:54
- The requirements for soldering solder joints of pcb manufacturing companies are shown in Table 12-1 below.
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- [Company News]Prototype pcb manufacturing solder joint formation process and influencing factors2019/10/24/ 16:08
- The prototype pcb manufacturing electronic product is soldered by heating and flux applications to activate the flux, remove the oxide film on the surface to be soldered, liquefy the solder and complete the wetting and diffusion process to form solder joints. Specifically, the formation of solder joints involves two processes:
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- [Company News]Prototype pcb manufacturing complete solder joint requirements2019/10/23/ 14:36
- Prototype pcb manufacturing complete solder joint requirements are introduced in the article
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- [Company News]How does pcb board manufacturer protect against static electricity?2019/10/18/ 16:40
- PCB board manufacturer regularly check tools with anti-static requirements to keep them in a qualified state; test environmental parameters such as humidity, temperature, concentration, static point position, etc.; test the electrostatic sensitivity of the product and establish a quality analysis and feedback system.
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- [Company News]Prototype pcb manufacturing defect analysis and solutions2019/10/17/ 21:29
- Prototype pcb manufacturing defect analysis and solutions 1. PCB deformation is greatly, bending Causes analysis of defects A. High preheating temperature B. Long time pass tin C. The temperature of the tin pot is high D. The cooling rate ...
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- [Company News]Prototype pcb failure cause analysis (2)2019/09/22/ 00:01
- As the hub of various components and circuit signal transmission, prototype PCB has become the most important and key part of electronic information products.Which quality and reliability determine the quality and reliability of the whole equipment.
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- [Company News]Prototype pcb failure cause analysis (1)2019/09/19/ 13:44
- As the hub of various components and circuit signal transmission, prototype PCB has become the most important and key part of electronic information products.Which quality and reliability determine the quality and reliability of the whole equipment.
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- [Company News]Circuit boards electrical faults analysis and detection method2019/08/28/ 10:39
- Electronic circuit troubleshooting can generally be detected by input to the output sequence or by the reverse method of output to input.
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